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TA84007PQ/SG/FG
Preliminary
TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic
TA84007PQ,TA84007SG,TA84007FG
DC Motor Full Bridge Driver ICs (Forward/reverse switching driver ICs)
The TA84007PQ, TA84007SG and TA84007FG are bridge driver ICs designed for forward/reverse rotation switching and that are capable of four modes of control (forward, reverse, stop and brake). The TA84007PQ has an output current of 1.0 A (AVE.) and 2.0 A (PEAK) and the TA84007SG and TA84007FG have an output current of 0.4 A (AVE.) and 1.2 A (PEAK). These driver ICs are equipped with a dual power supply pin on the output and control sides and a Vref pin on the output side capable of controlling motor voltage making it possible to adjust the voltage applied to the motor. Additionally, these driver ICs have a low input current and can connect directly to the CMOS.
TA84007PQ
TA84007SG
Features
* Operation power supply voltage range: VCC (opr.) = 4.5 to 27 V VS (opr.) = 4.5 to 27 V Vref (opr.) = 4.5 to 27 V Usage Note: Design your application so that Vref VS Output current: PQ: 1.0 A (AVE.), 2.0 A (PEAK) SG and FG: 0.4 A (AVE.), 1.2 A (PEAK) Built-in thermal shutdown and overcurrent protection Built-in back EMF suppression diode Built-in input hysteresis Built-in standby
* * * * *
TA84007FG
Note: These ICs are highly sensitive to electrostatic discharge. When handling them, please be careful of electrostatic discharge, temperature and humidity conditions.
Weight HSIP10-P-2.54: 2.47 g (typ.) SOIP9-P-2.54A: 0.92 g (typ.) HSOP16-P-300-1.00: 0.50 g (typ.)
The following conditions apply to solderability: *Solderability 1. Use of Sn-37Pb solder bath *solder bath temperature = 230C *dipping time = 5 seconds *number of times = once *use of R-type flux 2. Use of Sn-3.0Ag-0.5Cu solder bath *solder bath temperature = 245C *dipping time = 5 seconds *number of times = once *use of R-type flux
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Block Diagram
VCC 7/2/11 4/8/5 8/6/15 VS Vref
REG 2/7/4
OUT1
M Protector (thermal shutdown) 10/3/13 OUT2
5/9/7 IN1 IN2
6/1/9
1/5/1 GND TA84007PG/SG/FG
Pin Functions
Symbol PQ VCC VS Vref GND IN1 IN2 OUT1 OUT2 7 8 4 1 5 6 2 10 Pin No. SG 2 6 8 5 9 1 7 3 FG 11 15 5 1 7 9 4 13 Logic side power supply pin Output side power supply pin Control power supply pin Ground Input pin Input pin Output pin Output pin Description
PQ: No. 3 and 9 pins are NC (no connection) SG: No. 4 pin is NC FG: No. 2, 3, 6, 8, 10, 12, 14 and 16 pins are NC Toshiba recommends shorting the TA84007FG's fin to GND. (The fin is shorted on the rear side of the IC chip and has a grounding electrical potential.)
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Function
Input IN1 0 1 0 1 IN2 0 0 1 1 OUT1 H L L Output OUT2 L H L Stop CW/CCW CCW/CW Brake Mode
: High impedance Note: Input is high-active
Absolute Maximum Ratings (Ta = 25C)
Characteristics Logic side power supply voltage Symbol VCC VCC (opr.) Output side power supply voltage VS VS (opr.) Control power supply voltage PQ PEAK SG and FG Power current PQ AVE. SG and FG PQ Power dissipation SG FG Operating temperature Storage temperature Topr Tstg PD IO (AVE.) 1.0 0.4 12.5 (Note 1) 0.95 (Note 2) 1.4 (Note 3) -30 to 75 -55 to 150 C C W IO (PEAK) Vref Vref (opr.) Rating 30 27 30 V 27 30 V 27 2.0 1.2 A Unit V
Note 1: Tc = 25C Note 2: Standalone IC Note 3: PCB mounting condition (PCB area 60 x 30 x 1.6 mm, occupies copper area of 50% or greater) Operation power supply voltage range: VCC (opr.) = 4.5 to 27 V VS (opr.) = 4.5 to 27 V Vref (opr.) = 4.5 to 27 V Vref VS
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Electrical Characteristics (Ta = 25C, VCC = 5 V, VS = 24 V)
Characteristics Symbol ICC1 Power supply current ICC2 ICC3 1 (high) Input voltage 2 (low) Input current Upper SG and FG Lower VSAT L-1 VIN1 VIN2 IIN VSAT U-1 2 1 Test Circuit Test Condition Output OFF, CW/CCW mode Output OFF, Stop mode Output OFF, Brake mode Tj = 25C Sink VIN = 3.5 V Vref = VS output - VS measure IO = 0.2 A, CW/CCW mode Vref = VS output - VS measure IO = 0.2 A, CW/CCW mode Vref = VS output - VS measure IO = 0.4 A, CW/CCW mode 3 Lower VSAT L-2 Vref = VS output - VS measure IO = 0.4 A, CW/CCW mode Vref = VS output - VS measure IO = 1.0 A, CW/CCW mode Vref = VS output - VS measure IO = 1.0 A, CW/CCW mode Vref = 10 V output - GND measure, IO = 0.2 A, CW/CCW mode Vref = 10 V output - GND measure, IO = 0.4 A, CW/CCW mode 3 VSAT U-3' PQ VSAT U-4' Output transistor leakage current Upper Lower ILU ILL VF U-1 VF U-2 VF L-1 VF L-2 Iref 2 5 Vref = 10 V output - GND measure, IO = 0.5 A, CW/CCW mode Vref = 10 V output - GND measure, IO = 1.0 A, CW/CCW mode 4 VL = 30 V VL = 30 V Vref = 10 V, source type Min. 3.5 GND Typ. 11.0 0 9.5 3 0.9 Max. 16.0 50 13.0 5.5 V 0.8 10 1.2 A Unit mA A mA
0.8
1.2
Upper Output saturation voltage SG and FG
VSAT U-2
1.0
1.35 V
0.9
1.35
Upper PQ Lower
VSAT U-3
1.3
1.8
VSAT L-3
1.2
1.85
VSAT U-1' SG and FG VSAT U-2' Upper side residual voltage
11.2
10.4
10.9
12.2 V
11.0
10.2
10.7 1.5 2.5 0.9 1.2
12.0 10 10 40 A V
A
SG and FG Upper Diode forward voltage PQ Lower
SG and FG Upper PQ Lower
Control power supply current
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Test Circuit 1.
ICC1, ICC2, ICC3
7/2/11
4/8/5
8/6/15
A
VCC
SW2 VIN (H) 3.5 V
VIN2
6/1/9 1/5/1 GND
10/3/13
TA84007FG's fin is shorted to GND
Test Circuit 2.
VIN1, VIN 2, IIN, Iref
5V
SW1
VIN1
5/9/7
TA84007PQ/SG/AFG
2/7/4
VS = 24 V
VS
A
10 V
VS VCC 5V SW1 VIN1 VIN2 A VIN SW2 5 V (max) 0 V (min) 5/9/7 6/1/9 1/5/1 GND TA84007PQ/SG/FG 2/7/4 OUT1 10/3/13 OUT2 TA84007PQ/SG/FG TA84007FG's fin is shorted to GND VS = 24 V SW3 7/2/11 4/8/5 8/6/15
Vref
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Test Circuit 3.
VSAT U-1, 2, 3 VSAT L-1, 2, 3
VCC
VSAT U-1', 2', 3', 4'
SW4 10 V V VS 8/6/15 OUT1 5/9/7 6/1/9 1/5/1 GND TA84007PQ/SG/FG 2/7/4 VS 10/3/13 SW3 OUT2 V A VL A VL VU IU VL = 30 V V SW1 SW2 VU IL V VL = 30 V
5V
7/2/11 VIN1
4/8/5
RL (Note)
Vref
SW1
SW2 VIN (H) 3.5 V
VIN2
TA84007FG's fin is shorted to GND
Note: Use RL to calibrate IOUT to 0.2 A, 0.4 A, 0.5 A or 1.0 A.
Test Circuit 4.
ILU, L
VS 7/2/11 4/8/5 8/6/15 OUT1 5/9/7 TA84007PQ/SG/FG 2/7/4
6/1/9 1/5/1
10/3/13 OUT2
TA84007PQ/SG/FG TA84007FG's fin is shorted to GND
Test Circuit 5.
VF U-1, 2 VF L-1, 2
VS 7/2/11 4/8/5 8/6/15 OUT1 5/9/7 6/1/9 1/5/1 TA84007PQ/SG/FG 2/7/4
10/3/13 OUT2
VS = 24 V
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TA84007PQ PD - Ta
15 (1) Infinite heat sink 80 cm2 x 2 mm Al equivalent (HS = 6C/W) 10 (2) (4) (3) 15 cm2 x 2 mm Al equivalent (HS = 20C/W) No heat sink j-a = 65C/W 5 (3) (4)
TA84007PQ t - Rth
(1) Infinite heat sink 80 cm2 x 2 mm Al heat sink 25 cm2 x 2 mm Al heat sink No heat sink Input pulse
(W)
(1)
(2)
Transient thermal resistance Rth (C/W)
(2) (3) (4)
PW t (s)
(4) (3)
Power dissipation PD
100 50 30 (2) 10 5 3 (1)
0 0 50 100 150 200
1 10-2
10-1
1
10
102
103
Ambient temperature
Ta (C)
Pulse width t
(s)
TA84007SG PD - Ta
2.0 Standalone j-a = 130C/W 1000 500 300
TA84007SG t - Rth
Standalone
(W)
Power dissipation PD
Transient thermal resistance Rth (C/W)
1.6
100 50 30 Input pulse 10 5 3 PW
1.2
0.8
0.4
t (s)
1 10 100 1000
0 0
25
50
75
100
125
150
175
1 0.1
Ambient temperature
Ta (C)
Pulse width t
(s)
TA84007FG PD - Ta
2.0 (1) 1.6 (1) (2) 1.2 PCB mounting condition PCB area 60 x 30 x 1.6 mm occupies copper area of 50% or greater Standalone j-a = 140C/W
TA84007FG t - Rth
(1) (2) Standalone PCB mounting condition PCB area 60 x 30 x 1.6 mm occupies copper area of 50% or greater Input pulse PW
(W)
Transient thermal resistance Rth (C/W)
t (s) (1)
Power dissipation PD
200
100 (2) 50 30
0.8
(2)
0.4
0 0
25
50
75
100
125
150
175
10 1
10
100
1000
Ambient temperature
Ta (C)
Pulse width t
(s)
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TA84007PQ VCE (SAT) - IOUT (upper side)
3.2 3.2
TA84007PQ VCE (SAT) - IOUT (lower side)
2.4
2.4
(V)
VCE (SAT)
1.6
VCE (SAT)
0.4 0.8 1.2 1.6 2.0
(V)
1.6 0.8 0.8 0 0 0 0
0.4
0.8
1.2
1.6
2.0
IOUT
(A)
IOUT
(A)
Vref - VOUT (H) Characteristics
Test circuit VS = 12 V VCC = 5 V
VS - VOUT (H) Characteristics
Test circuit VCC 5V Vref = 8.0 V VCC = 5.0 V VS 7/2/11 VCC 5/9/7 8/6/15 VS OUT1 Vref 4/8/5 2/7/4 V 10 10 11 40 Open IN1 IN2 G 1/5/1
7/2/11 VCC 5/9/7 6/1/9 IN1 IN2 G 1/5/1
8/6/15 VS OUT1 Vref 4/8/5 2/7/4 V
12 V
5V
Open
6/1/9 10 40
TA84007FG's fin is shorted to GND 12 Output open 10 9 10
8V
TA84007FG's fin is shorted to GND Output open
40 load 10 load
(V)
40 load 6 10 load
VOUT (H)
VOUT (H)
12
(V)
8
8
4
7 2
0 0
6 2 4 6 8 10 8 9 12
Vref
(V)
VS
(V)
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Usage Precautions
Power Input
When turning on the power, first apply power to VCC and then apply power to VS. (NOTE: It is also okay to apply power to both at the same time.) When turning off the power, first turn off VS and then turn off VCC. (NOTE: It is also okay to turn off both at the same time.)
Input Circuitry
As shown in the drawing, input is high-active. When you apply the defined VIN (H) amount of voltage (or greater), the logic will go high and if you apply the defined VIN (L) amount of voltage (or lower) the corresponding pin will be grounded and logic will go low. In addition, when logic is high, input current IIN will be inputted so be careful of the prior stage's output impedance. Input hysteresis is 0.7 V (typ.) When turning on the power (VCC), keep input (both IN1 and IN2) low.
VCC standby
VIN VIN 5/9/7 or 6/1/9
1 k 4.5 k
10 k
5 k
Output Circuitry
Output "H" Voltage
* Vref Voltage Operation The voltage applied to Vref is filtered through the Vref circuit and the resulting 2VBE (small signal) high voltage is applied to Q2 (Pw Tr)'s base-A. The resulting VBE (Q2) low voltage is output as VOUT (H). VOUT = Vref + 2VBE - VBE (Q2) @ Vref + 0.7 V About the Vref Pin When you aren't using the Vref pin, don't leave it open but rather connect it to the VS pin using protective resistance (of 3 k or higher). Also, design your application so that Vref VS.
TA84007PQ/SG/FG
8/6/15 Q1 A Vref circuit
Q2
1.3 k 1/5/1 or 10/3/13 2/7/4 4/8/5 VOUT Vref
*
1/5/1
Protector Function
Overcurrent Protection
TA84007PQ/SG/FG
If the current flowing to the upper power transistor is detected as being over the configured current threshold (about 2.5 A), the overcurrent protector turns off all output. However, this doesn't protect against all potential overcurrent scenarios. For example, it is possible to destroy the IC due to an output short-circuit or grounding fault prior to the overcurrent protector even being activated. Please connect a resistor or fuse to the power (VS) line as protection against such overcurrent scenarios. (Refer to the application example on the next page.)
Thermal Shutdown
If the chip's temperature is detected as being over the configured temperature threshold (about 170C), the thermal shutdown circuit turns off all output.
10 k
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Application Example
R1 (Note 2) VS (Note 1) 10 F VCC R2 (Note 3)
7/2/11
8/6/15
4/8/5
IN1 IN2
5/9/7 6/1/9
TA84007PQ/SG/FG
2/7/4 M 10/3/13
1/5/1 GND TA84007PQ/SG/FG
Note 1: Experiment to determine the optimum capacity value (22 F or greater) for the capacitor. Position the capacitor near the pin (within 20 mm). Note 2: Use a current limiting resistor (R1) to protect against overcurrent. Note 3: If you wish to use the IC with VS = Vref, use a resistor to protect against Vref pin surge Note 4: Utmost care is necessary in the design of the output, VCC, VM, and GND lines since the IC may be destroyed by short-circuiting between outputs, air contamination faults, or faults due to improper grounding, or by short-circuiting between contiguous pins.
Application Precautions
* * Insert a stop (of about 100 s) during switching (forward U reverse, forward/reverse U brake) to prevent against in-rush current flow. IC functionality is not guaranteed when the IC is being powered on and off. Please confirm that there will be no problems in your application in this regard.
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Package Dimensions
Weight: 2.47 g (typ.)
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Package Dimensions
Weight: 0.92 g (typ.)
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Package Dimensions
Weight: 0.50 g (typ.)
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Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. Timing charts may be simplified for explanatory purposes. The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
2. Equivalent Circuits
3. Timing Charts
4. Application Circuits
5. Test Circuits
IC Usage Considerations
Notes on handling of ICs
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time.
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Points to remember on handling of ICs
(1) Over current Protection Circuit Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances. If the Over current protection circuits operate against the over current, clear the over current status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the IC may generate heat resulting in breakdown. (2) Thermal Shutdown Circuit Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation. (3) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (4) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor's power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device's motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design.
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